The production of double-sided board is more sophisticated than single-sided board. The main reasons are as follows: Look at embedded capacitance layers for high-frequency decoupling and conduct submit-structure simulations to validate power integrity. Use thermal relief connections for power pins to balance thermal management and manufacturability. Put into action separate https://andyrtvvw.qodsblog.com/31395570/rumored-buzz-on-10-layer-5g-communication-pcb